Diamond tools for the semiconductor industry
rod grinding Tool diamond wheel for cylindrical grinding. Benefits Cost-effective operation by fast material removal. Minimal influence on crystalline structure. Machines e.g. UEDA GIKEN (1 or 2 spindles), or cylindrical grinding machines. Program Type D W T X H*) Machine e.g. mm mm mm mm mm K6A2 75 4 6 UEDA GIKEN with Winter adapter K1A1 300 ...
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